http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100242024-B1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0269
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09918
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10681
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K37-0408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
filingDate 1997-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2000-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2000-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100242024-B1
titleOfInvention Method for mounting integrated circuit
abstract Disclosed is an integrated circuit mounting method for mounting a TCP (Tape Carrier Package) type integrated circuit on a printed circuit board in a process for mounting an integrated circuit having a plurality of leads on a printed circuit board.n n n The integrated circuit mounting method of the present invention for mounting a TCP-type integrated circuit on a printed circuit board is performed by continuously conducting a conductive bond applying step, a flux applying step, a cutting and forming step, an alignment step, a soldering step, and a cooling step. Improves soldering quality and improves productivity by significantly reducing work time.
priorityDate 1997-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419569950
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23991

Total number of triples: 33.