| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9152981d33d85d4c254e7d2b0241fec2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 |
| filingDate |
1996-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ea255496e567723925d58c5213c17ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3149bfb45a1294b0fb341b03a9b5c851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c2f043fc87a99bcfffbfd831c4e85c9 |
| publicationDate |
1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100236430-B1 |
| titleOfInvention |
Tin-Lead Alloy Plating Bath |
| abstract |
In the plating bath, a tin-lead alloy containing an organic sulfonic acid can form a solder adhesion film having the same composition ratio as the Sn / Pb composition ratio in the plating bath, and even when the current density is different, the composition ratio of the electrodeposition film is stable. Provide a tin-lead alloy plating bath. |
| priorityDate |
1995-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |