http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100234370-B1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02247
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31058
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
filingDate 1997-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fa89de63e5850bdc3c13e544e70460e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14b27b7bdb651ffde21c4af4da7354ef
publicationDate 1999-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100234370-B1
titleOfInvention Planarization Method of Semiconductor Device
abstract A predetermined pattern is formed on the semiconductor substrate, a first insulating film is formed on the resultant, and a hydrophilic layer is selectively formed only on a region where the step height of the first insulating film is high. Disclosed is a method of planarizing a semiconductor device, wherein the second insulating film is formed using an organic insulating material having hydrophobicity.n n n According to the present invention, global planarization of a semiconductor device can be achieved.
priorityDate 1997-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458397310

Total number of triples: 18.