http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100219757-B1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4595649a5ed850f4e481676d008004c8 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
filingDate | 1996-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 1999-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00ccc047c25544feb1389b237ad38325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4210efa1761b21b86e1cc23cd4550d7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57f9364a773af6ffa362d26cd47bcf6a |
publicationDate | 1999-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-100219757-B1 |
titleOfInvention | Manufacturing method of laminated thin film inductor |
abstract | The present invention relates to a method of manufacturing a multilayer thin film inductor, which comprises etching an organic material reacting with light and electroplating the metal pattern to a thickness smaller than the thickness of the organic material frame with a support frame (frame) A method of manufacturing a conductive pattern by coating a bonding layer after removing the organic material, removing a seed layer, and the like. The method of manufacturing a conductive pattern according to the present invention includes: . ≪ / RTI > |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102569032-A |
priorityDate | 1996-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.