http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100216838-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1b3cf4f779564e6a8405835835c4cf1f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4821 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate | 1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1999-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_334110463a260631cdb770f6f5d7ef5c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2cac94b0d4100b335769f8e8794f412 |
| publicationDate | 1999-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100216838-B1 |
| titleOfInvention | Electrochemical silver release agent used in leadframe manufacturing process |
| abstract | The present invention relates to a silver peeling solution used to electrochemically peel a silver plated portion of an undesired portion in silver plating of a copper or copper alloy, nickel or nickel alloy substrate, and more particularly, in a lead frame manufacturing process. The present invention relates to a silver release agent for peeling a portion that does not require silver plating after silver plating is performed on a specific region. More specifically, silver foil for peeling unwanted portions after silver plating is applied to a specific region during a lead frame manufacturing process. It is about Rize.n n n The present invention provides a silver release agent for selectively peeling silver plated regions on a lead frame during a lead frame manufacturing process based on copper or a copper alloy. 550 g / And a compound selected from the group consisting of an alkali metal or alkaline earth metal compound, and one compound selected from the group consisting of sodium tetraborate, potassium tetraborate and alkaline earth metal compounds.n n n The present invention selectively peels the silver strike plated portion or the silver bleed portion without any damage to the selectively silver plated region, and in this process, the deposition reaction between the silver ions and the copper surface existing in the solution after the peeling and copper No black spots are produced by the formation of polymers of the Si component present in the alloy. |
| priorityDate | 1996-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.