http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100216488-B1

Outgoing Links

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filingDate 1996-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bebcc96a5d7f27c715fdd6d20b135a1e
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publicationDate 1999-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100216488-B1
titleOfInvention How to Form a Circuit Assembly
abstract The present invention comprises the steps of coating a polyamic acid ester layer selected from a unique polyamic acid ester group on a substrate (i), imidizing the polyamic acid ester to form a polyimide layer having a smooth surface, (ii) And (iii) imidizing the polyamic acid ester to form a polyimide layer having a smooth surface.
priorityDate 1995-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.