| abstract |
This invention discloses the thermosetting resin composition which provides the hardened | cured material which is excellent in workability, excellent in adhesiveness, and excellent in heat resistance, low thermal expansion, and low water absorption.n n n (A) an imide compound having a maleimide group represented by the following formula (1), (B) a resin having at least two or more epoxy groups in one molecule, (C) a molecule having a phenolic hydroxy group in one molecule, and (B) And / or (C) component has a double bond which conjugates an aromatic group, and (B) component and / or (C) component have a naphthalene ring, The thermosetting resin composition characterized by the above-mentioned.n n n [Formula 1]n n n n n n n n [Formula 2] |