| abstract |
This invention uses together the epoxy resin containing a naphthalene ring, and the epoxy resin containing a biphenyl group, and simultaneously uses the phenol resin of following formulan n n n n n n n (Wherein R 3 is Or a group in which some or all of the hydrogen atoms of these groups are substituted with alkyl groups having 1 to 5 carbon atoms, R 4 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, r is an integer of 0-5.) And (D) inorganic The present invention relates to an epoxy resin composition having a filler as an essential component.n n n The epoxy resin composition is a combination of the above-described components, and has good fluidity and low modulus of elasticity, particularly at a temperature higher than the glass transition, significantly lowers the modulus of elasticity, has a low linear expansion coefficient, and has a low stress and glass transition temperature. And a low hygroscopic hardened | cured material is obtained, and the semiconductor device enclosed with the hardened | cured material of the said epoxy resin composition has high reliability also in the thermal shock at the time of surface mounting. |