http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100196820-B1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
filingDate 1996-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_852ef5f76746d1b1b8efdffc4f16292c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00d42fd91ca3ce171b86c260455ef2b2
publicationDate 1999-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100196820-B1
titleOfInvention Formation of interconnects for testing unpackaged semiconductor dice
abstract The present invention provides a method of forming an interconnect suitable for realizing electrical connection with a semiconductor die. The method includes providing a microbump tape, and thereafter, mounting the tape on a substrate using a compliant layer therebetween. The micro bump tape has an insulating film having a pattern of micro bump connecting members corresponding to the pattern of the bond pads on the die. The compliant layer may be formed of a curable adhesive, such as a silicone polymer. Coupons having a plurality of microbump tapes may be mounted to substrate wafers that may be separated to form a plurality of interconnects. This interconnect can be used as a test device for testing unpackaged semiconductor dice.
priorityDate 1995-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6326954
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523132

Total number of triples: 19.