| abstract |
The present invention discloses a semiconductor lead frame having an improved plating layer structure. According to a feature of the present invention, a Pd strike plating layer is formed on a Ni plating layer formed of an intermediate plating layer, and an alloy plating layer of a Pd-X composition is formed as an outermost plating layer. With a multi-layered plating layer, the Pd strike plating layer conceals pores on the surface of the NI plating layer, which is an intermediate layer, and maintains uniform thickness of the outermost Pd-X composition alloy plating layer to increase corrosion resistance, By minimizing the formation and progression of cracks through enhanced adhesion, it is possible to improve the overall characteristics of the lead frame, such as wire bonding and solderability, and to expect high yield in the semiconductor package process, thereby improving productivity. |