| abstract |
The present invention aims to provide a ceramic substrate having a semiconductor LSI, a chip component, and the like, in which a solder bridge is hardly generated and highly reliable, and a method of manufacturing the same. And a step of punching the projection sheet green sheet 4, a step of filling the hole with a conductor paste, a step of forming the wiring pattern 5 in the substrate sheet green sheet, and the projection sheet The projections 1 made of a conductor are formed by laminating the green sheet as the outermost layer and the green sheet for substrate construction as an inner layer, firing the laminate, and removing the outermost layer of the fired product. It is possible to form at the time of manufacture of a ceramic wiring board. By using a projection made of a conductor as an external connection terminal, it is possible to widen the connection interval between the ceramic substrate having the projection and another arbitrary substrate, and to eliminate the problems such as solder bridges generated when the substrate is connected. will be. |