| abstract |
(a) Ethrimide type compound represented by general formula (I)n n n n n n n n Wherein each of R 1 to R 4 , R 7 and R 8 is one selected from hydrogen, lower alkyl group, lower alkoxy group, lower fluoroalkyl group, chlorine or bromine, and may be the same or different from each other, and R 5 and R 6 is one selected from hydrogen, methyl group, ethyl group, trifluoromethyl group, or trichloromethyl group, and may be the same as or different from each other, and D is a dicarboxylic acid hydrocarbon residue having an ethylenically unsaturated double bond) Heat conductivity, moisture resistance, and excellent moldability, comprising an etherimide compound having an electrical conductivity of 300 kW / cm or less, a pH of 1.5-7, and an epoxy resin, extracted at 120 ° C. or more at 120 ° C. for 100 hours or more. And a resin composition for semiconductor encapsulation having an adhesive force and a semiconductor device encapsulated with this resin. |