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filingDate 1994-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_528e56979bc78a351fbd064ee7604ca7
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publicationDate 1999-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-0159964-B1
titleOfInvention Thermosetting compound, its hardened | cured material, and the manufacturing method of a thermosetting compound
abstract A novel thermosetting compound which cures rapidly and does not produce byproducts during curing and a cured product having excellent heat resistance and flammability is obtained.n n n Per molecule, at least one structural unit of the following general formula (A) and at least one structural unit of the following general formula (B) are contained in a molar ratio of (A) / (B) 1 / 0.25 to 1/9, wherein the structure A thermosetting compound characterized in that the units are bonded to each other directly or through one or more organic groups:n n n n n n n n [Wherein R 1 is a methyl group, a cyclohexyl group, an unsubstituted phenyl group or a phenyl group substituted with one or more substituents, except for one hydrogen atom in the o-position relative to the hydroxy group in the aromatic ring of (A) (A And each hydrogen atom on the aromatic ring of (B) and (B) may be optionally substituted with a substituent [
priorityDate 1993-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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