http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-0157349-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e08fd85d97265d6c31ab40f372843d81 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate | 1995-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1998-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a38577956e30c7b153339f6528bf58c |
| publicationDate | 1998-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-0157349-B1 |
| titleOfInvention | Elastomeric pressure wafer probe with pivotable magnetocentricity |
| abstract | An inspection probe 10 for inspecting the integrated circuit is configured on the integrated circuit die 15. The probe 10 includes a printed circuit board interface 11 having an opening 19 at the center thereof. The flexible thin film 21 is configured on the bottom surface of the printed circuit board interface 11 and is flexible near the center portion. A plurality of electrical traces 18 and a plurality of bumps 17 are formed on the flexible thin film 21, the passages of which are provided with a plurality of terminal pads 19 to enable interfacing between the integrated circuit 20 and external inspection equipment. Connected to the end. The transparent plastic window 12 has a portion of the window fixed to the interface 11. A conical retainer 13 having an opening 24 in the center is adjacent to the bottom surface of the transparent plastic window 12. A pivotable elastomeric member 14 having a top cut conical cross section is disposed between the bottom surface of the transparent plastic window 12. When the probe 10 is assembled, the flexible thin film 21 is disposed in a flexible position while extending outward relative to the non-flexible portion. The flexible thin film 21 is moved to the flexible position by the force exerted by the pivotable elastomeric member 14 and the transparent plastic pressure pivot plate 22 on the thin film. The elastomeric member 14 is compressed during interconnection to the integrated circuit 20 and deflected so that the flexible thin film 21 is inclined so that bumps and pads on the integrated circuit can be appropriately interlocked for the desired purpose. The upward movement of the die 15 and the integrated circuit 20 ensures contact between the bump 17 and the pad 29 and exerts a force to tilt the flexible thin film 21 when necessary. This probe is particularly suitable for very small integrated circuit die patterns, which are useful for inspections where the die pattern is less than 250 square inches. |
| priorityDate | 1994-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6581 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474364 |
Total number of triples: 17.