http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-0155314-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0455894a3bd6ed1302b8fd893e157fc |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67115 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
| filingDate | 1995-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1998-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_759e05f17f6ac72f3bc6a4550a85f59c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_952738c2bd7ea3b12a4bb1b16075e13f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0573cbabeb1d93441afd130f9cbe4321 |
| publicationDate | 1998-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-0155314-B1 |
| titleOfInvention | Metal liner flattening device using plasma surface treatment |
| abstract | The present invention relates to a planarization equipment for a wiring metal thin film using a plasma surface treatment in a semiconductor manufacturing process. The surface treatment by the plasma of the deposited metal thin film, the contact window and the via hole enables the removal of impurities and oxides on the surface of the substrate or the thin film. And precise temperature control is possible, and it is installed on the upper part of the reactor in order to perform reflow heat treatment by heating after metal thin film deposition and pretreatment process of contact window and via simultaneously or sequentially in one reactor. It has high ionization rate and low plasma potential, so there are few contaminants from the reactor and small ion energy incident on the wafer, so that TCP (Transformer Coupled Plasma) can be used as a plasma source to minimize damage to contact windows and via holes. A plasma cleaning module; A substrate heating module for heating the wafer holder assembly by an external lamp and a reflector for reflecting efficiency and temperature uniformity to enable heat treatment of the substrate by an indirect heating method; A vacuum module including a vacuum exhaust port on one side of the reactor for maintaining the vacuum of the reactor; It is characterized by consisting of a wafer transfer module having a wafer holder drive mechanism, a drive shaft and bellows as a component. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170102771-A |
| priorityDate | 1995-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.