http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-0154823-B1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-3357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-3358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-335
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J29-377
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J29-377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-335
filingDate 1995-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1998-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c25b14930b28e475bf1c3c3633467d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9565e7dac206a76e6a834485cb82d32c
publicationDate 1998-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-0154823-B1
titleOfInvention Thermal recording element
abstract The present invention relates to a thermal recording element and a method of manufacturing the same, and more particularly, to a thermal recording element in which a heat sink is divided into two parts. That is, the thermal sensing includes a resistance substrate including a plurality of heating elements for converting electrical energy into thermal energy, a heating substrate for driving the heating element and the resistance substrate, and a heat sink for dissipating heat generated from the heating element, the resistance substrate, and the driving substrate to the outside. As the recording element, the heat sink is divided into a first part and a second part which can be separated from each other, and the first part is located under the heat generating element, and a heat conductive filler having good thermal conductivity is inserted between the first heat sink and the resistance substrate. It is. If the heatsink is divided into two parts so that they can be separated from each other, if the heatsink filler is applied incorrectly, manufactured incorrectly, or if you want to remove the heatsink for repair, you can remove and replace or repair only a part of the heatsink without removing the whole heatsink. It is possible.
priorityDate 1995-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449871035
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID166598

Total number of triples: 19.