| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2707056d594790a62947ee030653e6f8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S430-109 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-016 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D171-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50 |
| filingDate |
1995-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09cb0b563c9f646ec147ef0ad9d35502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b89a4ed115b8b96a6dce88c93fbd1dea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39757fcbc4e7d2748e01341fb5a0e8d4 |
| publicationDate |
1998-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-0150344-B1 |
| titleOfInvention |
Photosensitive resin composition |
| abstract |
The present invention relates to a photo-sensitive resin composition used in the manufacture of a dry film photo-resist for circuit design of a printed circuit board, the photosensitive resin composition of the present invention is photopolymerizable It contains at least one water soluble monomer having at least two unsaturated polymerization capable of addition polymerization as a monomer and at least one water insoluble monomer, and the content of the water soluble monomer is 3 -15%, and the total amount (#M) of the reactor of the photopolymerizable monomer is 0.5 to 1.5 moles in 1 kg of solid content, and according to the present invention of the above-described characteristics, high development speed, flexibility of the exposure film and It is possible to provide a photoresist excellent in chemical resistance to plating chemicals. |
| priorityDate |
1995-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |