http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-0145332-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 1992-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1998-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_097e86a1757137b959550a167d0add89 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce37a0a5c8063e44f6c52a0b7a2fed3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b7ccd6160b04f61ab7d6611e317518a |
| publicationDate | 1998-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-0145332-B1 |
| titleOfInvention | Semiconductor Device-Encapsulation Epoxy Resin Composition |
| abstract | 70 to 95 weight based on the total weight of (i) an epoxy resin, (ii) a mixture of 4,4'-dihydroxybiphenyl and other multifunctional phenolized compounds, and (iii) an epoxy resin composition A semiconductor-encapsulated epoxy resin composition comprising% filler, wherein said epoxy resin (i) is at least one transfer selected from the group consisting of a bifunctional epoxy resin having a biphenyl skeleton and a bifunctional epoxy resin having a naphthalene skeleton The functional epoxy resin is included at least 50% by weight based on the weight of the epoxy resin (i), wherein the bifunctional epoxy resin having the biphenyl skeleton is represented by the following general formula (I):n n n n n n n n Wherein each of R 1 to R 8 independently represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms, and the difunctional epoxy resin having the naphthalene skeleton is represented by the following general formula (II), wherein the curing agent (ii) is a semiconductor-encapsulated epoxy resin composition, characterized in that it comprises 5 to 90% by weight of 4,4-dihydroxybiphenyl by weight of the curing agent.n n n n n n n n In the formula, two of R 11 to R 18 represent a 2,3-epoxypropoxy group, and the rest independently represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102197406-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102197405-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100386395-B1 |
| priorityDate | 1991-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 101.