| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22 |
| filingDate |
1994-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19208446bb36979cd6bd760f7f640502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9e38221526ae1daca066ed259dc0046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f77ee53a96a8be1908586d9f52f09310 |
| publicationDate |
1998-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-0145241-B1 |
| titleOfInvention |
Pretreatment solution for electroless plating |
| abstract |
Pretreatment solutions containing water, sulfuric acid, halides, organic acids as diluents and acting as adhesion promoters and do not cause etch corrosion provide a long service life and provide good adhesion of plated copper to both glass fabric and substrate resins. |
| priorityDate |
1993-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |