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filingDate 1994-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1997-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0e47af7b9239af7a91f319e7fa97021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1461029844b96a68bc30597f32288111
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publicationDate 1997-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-0123045-B1
titleOfInvention Aqueous adhesive composition for flexible printed circuit boards and coverlay films
abstract The present invention is 10-50% by weight of acrylonitrile, 30-80% by weight of alkyl acrylic ester having an alkyl group having 1-12 carbon atoms, 1-10% by weight of hydroxyethyl acrylate or hydroxyethyl methacrylate, glyci 50-80% by weight of water-dispersible acrylic copolymer composed of 1-10% by weight of diacrylate or glycidyl methacrylate and 5-20% by weight of water-soluble epoxy compound having two or more epoxy groups in one molecule, melamine formaldehyde resin An aqueous adhesive composition for a flexible printed circuit board and a coverlay film, comprising 1-10% by weight and 5-30% by weight of an aromatic bromine compound.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100380309-B1
priorityDate 1994-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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