http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020262632-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2020-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2020262632-A1 |
| titleOfInvention | Flux and solder paste |
| abstract | The flux according to the present invention is a halogen-free flux used for soldering, and is a thiox agent containing a polyamide compound in which one or more heat absorption peaks obtained by differential thermal analysis are all observed in the range of 130 to 200 ° C. And an activator containing an isocyanuric acid derivative, and the content of the isocyanuric acid derivative is 5.0% by mass or less based on the total flux. |
| priorityDate | 2019-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 106.