| abstract |
The resin composition of the present invention is a stress relaxation layer of a metal-based copper-clad laminate (100) composed of a metal plate (101), a stress relaxation layer (102), and a copper foil (103) laminated in this order. A resin composition used for forming (102), which contains an epoxy resin having a polyether structure, a phenoxy resin, and a heat-dissipating filler, and has a storage elastic modulus at 25 ° C. of 0.01 GPa or more. It satisfies the characteristic of .6 GPa or less. |