http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020122014-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2020122014-A1 |
| titleOfInvention | Wiring boards for semiconductor devices, their manufacturing methods, and semiconductor devices |
| abstract | It alleviates deformation and displacement stress between the interposer and the FC-BGA wiring board, prevents disconnection of the joint between the interposer and the FC-BGA wiring board, and improves the reliability of the connection between the interposer and the FC-BGA wiring board. It provides a high wiring board and a method for manufacturing the same. The wiring board includes an FC-BGA wiring board and an interposer, and the FC-BGA wiring board and the interposer are electrically bonded via protruding electrodes, respectively, and a sealing resin is formed in the gap between the FC-BGA wiring board and the interposer. The underfill is filled. Further, the underfill covers the entire side surface of the interposer and the peripheral edge of the surface opposite to the surface where the interposer joins the FC-BGA wiring board. |
| priorityDate | 2018-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.