| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68377
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2019-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2020116278-A1 |
| titleOfInvention |
Manufacturing method of composite sheet for forming protective film and semiconductor chip |
| abstract |
The back surface of the protective film-forming composite sheet (101) including the support sheet (10) and the protective film-forming film (13) formed on the first surface (10a) of the support sheet (10). The surface resistivity of the antistatic layer (17) is set to 1.0 × 1011 Ω / □ or less, and the test piece cut out from the protective film forming composite sheet (101) after heating at 70 ° C. for 1 minute and the porous table The frictional force between them shall be 20 N or less. |
| priorityDate |
2018-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |