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filingDate 2019-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2020032138-A1
titleOfInvention Composite structures and housings for electronic devices
abstract A composite structure including a metal member and a thermoplastic resin member bonded to the metal member, wherein the metal member has at least a fine concavo-convex structure on the metal surface to which the thermoplastic resin member is bonded, and JIS A composite in which the hardness of the thermoplastic resin member is in the range of A60 or more and A95 or less and the acid value of the thermoplastic resin member is 1 mgKOH / g or more and 100 mgKOH / g or less as measured by a type A durometer according to K6253. Structure. The thermoplastic resin member preferably contains a urethane-based thermoplastic elastomer, an amide-based thermoplastic elastomer, and an acid-modified polyolefin.
priorityDate 2018-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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