patent/JP-WO2020026937-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020026937-A1

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filingDate	2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2021-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-WO2020026937-A1
titleOfInvention	Resin composition, resin sheet, cured film, method for manufacturing cured film, semiconductor device and display device
abstract	It is possible to improve the resistance to flux and reflow resistance used during soldering, and if it is a photosensitive resin composition, even a thick film of 15 μm or more after curing can be processed with high sensitivity. Is provided. A resin composition containing (A) a resin having a structural unit represented by the general formula (1) and / or the general formula (2), (B) a phenol resin, and (C) an antioxidant, said (B). ) The phenol resin is a resin composition containing a structure represented by the general formula (3).
priorityDate	2018-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426791895 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID467491278 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18175903

Total number of triples: 85.