http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019188836-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2019-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2019188836-A1 |
| titleOfInvention | Method for manufacturing multilayer wiring board |
| abstract | Provided is a method for producing a multilayer wiring board, which is capable of extremely effectively preventing penetration of an inner layer circuit by laser processing while having excellent circuit adhesion. This method for manufacturing a multilayer wiring board includes (a) a step of laminating a first insulating layer and a second metal foil in order on a first metal foil to form a first laminate, and (b) a second wiring layer. A step of forming, a step of (c) sequentially laminating a second insulating layer and a third metal foil to form a second laminated body, and (d) a step of forming a first via hole and a second via hole ( e) a step of forming a multilayer wiring board including a first wiring layer, a second wiring layer and a third wiring layer, wherein at least a surface of the second metal foil facing the first insulating layer is Fourier transform infrared spectroscopy. The reflectance of a laser having a wavelength of 10.6 μm measured by a photometer (FT-IR) is 80% or more, and the peak density Spd of peaks measured according to ISO25178 is 7,000 pieces / mm 2 or more 15000. The number of pieces / mm 2 or less. |
| priorityDate | 2018-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.