http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019188206-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10151 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04112 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2019-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2019188206-A1 |
| titleOfInvention | Conductive film, touch panel sensor, touch panel |
| abstract | The present invention provides a conductive film, a touch panel sensor, and a touch panel, in which surface changes are suppressed and the protective layer has excellent light-resistant adhesion. The conductive film of the present invention comprises a substrate, a patterned layer to be plated having a functional group that interacts with a plating catalyst or a precursor thereof, and a patterned layer to be plated, which are arranged on at least one surface of the substrate. A copper plating layer arranged so as to cover and contacting the substrate, a metal layer containing a metal which is electrochemically noble than copper and arranged so as to cover the copper plating layer, and an electrochemically noble metal layer than copper. It includes a nitrogen-containing compound layer arranged so as to cover a metal layer containing a metal, and a protective layer arranged so as to cover the nitrogen-containing compound layer. [Selection diagram] None |
| priorityDate | 2018-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 127.