| abstract |
The present invention is a negative photosensitive resin composition containing (A) an epoxy resin, (B) a compound having a phenolic hydroxyl group, and (C) a photocationic polymerization initiator, wherein 30 of the (A) epoxy resin. In the following formula (1) (in formula (1), R represents a glycidyl group or a hydrogen atom independently, and at least two of a plurality of Rs are glycidyl groups. A is a repeating unit. It is an epoxy resin (A-1) represented by (a real number in the range of 0 to 30) showing an average value of numbers, and (B) a compound having a phenolic hydroxyl group and (C) a photocation. A negative photosensitive resin composition in which the polymerization initiator has a specific structure. |