http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019131413-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2018-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2019131413-A1 |
| titleOfInvention | Thermosetting composition, thermosetting resin modifier, cured product thereof, semiconductor encapsulant material, prepreg, circuit board and build-up film |
| abstract | An object of the present invention is a thermosetting composition, a thermosetting resin modifier, which can achieve good copper foil adhesion, elastic modulus, heat resistance and toughness in a well-balanced manner in the obtained cured product. The present invention is to provide a cured product, a semiconductor encapsulant material, a prepreg, a circuit board, and a build-up film. The present invention is a thermosetting composition containing a thermosetting resin, a thermosetting agent and a modified resin, wherein the modified resin has at least one selected from the group consisting of hydroxyl groups and carboxy groups. A thermosetting resin, characterized in that the glass transition temperature of the modified resin is −100 ° C. or higher and 50 ° C. or lower, and the number average molecular weight of the modified resin is 600 or higher and 50,000 or lower. Use the composition. |
| priorityDate | 2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 265.