| abstract |
A film that can suppress both the generation of wrinkles when the release film is adsorbed on the cavity surface in compression molding and the generation of wrinkles when the bottom surface of the cavity where the release film is adsorbed is raised, and semiconductor devices using this. Providing manufacturing methods. The laminated film 1 has a storage elastic modulus E'at 180 ° C. of 70 MPa or more, and a heat shrinkage rate of 3% or more at 180 ° C. for 30 minutes based on 20 ° C. in each of the mechanical direction (MD) and the transverse direction (TD). It includes a layer 3 of a shrinkable film and a fluororesin layer 5 existing on one or both sides of the shrinkable film layer 3. |