| abstract |
The problem to be solved by the invention is to provide a laminate of a polyimide film and an inorganic substrate which is useful for producing a flexible electronic device including a fine device array such as an organic EL display element with a high yield. By laminating a polyimide film from which inorganic substances have been removed by sufficient washing and cleaning and an inorganic substrate to form a laminate, further heat-treating at a temperature of 350 ° C. or more and less than 600 ° C., and then quenching, the organic By reducing carbonization of foreign matter and rapidly cooling the gas in the blister, the height of the blister is reduced, and the number density of blister defects containing carbide particles inside is 50 or less per square meter, and the average height of the blister To obtain a laminate of a polyimide film and an inorganic substrate, wherein the product of the blister number density (pieces / square meter) and the average height of the blister (μm) is 20 or less. |