| abstract |
In the present invention, (A) the following formula (1) (in the formula (1), R 1 each independently represents an organic group, provided that at least one of R 1 has an organic group having a glycidyl group or an oxetanyl group. (B) a compound having a triazine ring represented by an organic group: (B) an epoxy equivalent having a benzene skeleton and two or more epoxy groups in one molecule is 500 g / eq. A negative photosensitive resin composition containing the following epoxy resin and (C) a cationic photopolymerization initiator, wherein the (B) epoxy resin contains the compound represented by the formula (1) with respect to the (A). And the (B) epoxy resin has the following conditions (i) and (ii): condition (i) a weight average molecular weight of 500 or more; and condition (ii) a softening point. Is at least one of 40 ° C. or higher. |