| abstract |
Provided are a photosensitive resin composition having a small degree of warp of a cured film after curing and having excellent lithographic properties when forming a pattern, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. A photosensitive resin composition comprising a polyimide precursor containing a repeating unit containing a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical when irradiated with light. |