abstract |
The power module of the present invention has a thermal conductivity higher than that of a power wiring provided with a power element, a glass ceramic multilayer substrate provided with a control element for controlling the power element, and a glass ceramic included in the glass ceramic multilayer substrate. A high thermal conductivity ceramic substrate made of a high ceramic material, wherein the power wiring is provided on the high thermal conductivity ceramic substrate, and the glass ceramic multilayer substrate is directly provided on the high thermal conductivity ceramic substrate. And |