abstract |
The present invention is a photosensitive siloxane resin that can be cured at low temperature, has excellent storage stability and resolution, can suppress development residue, has high hardness, and has a chemical resistance and excellent substrate adhesion. It is an object to provide a composition. The present invention is a photosensitive siloxane resin composition containing (A) polysiloxane, (B) a photoradical polymerization initiator, (C) a polyfunctional monomer, and (D) a phosphoric acid derivative amine salt. |