| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F297-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0234
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D153-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02315 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 |
| filingDate |
2018-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2018155555-A1 |
| titleOfInvention |
Method for selective modification of substrate surface |
| abstract |
The present invention has a surface layer, a step of preparing a substrate containing silicon oxide or nitride in a first region of the surface layer, and oxidizing and hydrophilizing at least a part of the surface of the substrate. A step of applying at least one selected surface treatment, and a step of applying a non-photosensitive composition to the surface of the substrate after the surface treatment step, wherein the non-photosensitive composition contains a nitrogen atom. This is a method for selectively modifying the surface of a substrate containing a first polymer and a solvent. The surface layer of the base material may be a region other than the first region and further include a second region containing a metal. In the surface treatment step, it is preferable to perform O 2 plasma treatment. |
| priorityDate |
2017-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |