http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018150945-A1
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate | 2018-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2018150945-A1 |
titleOfInvention | Silicon substrate intermediate polishing composition and silicon substrate polishing composition set |
abstract | Provided is a polishing composition that is used in a step upstream of a finish polishing step of a silicon substrate and can effectively realize a high-quality surface after the finish polishing step. According to the present invention, there is provided an intermediate polishing composition used in the intermediate polishing step in a silicon substrate polishing process including an intermediate polishing step and a final polishing step. The intermediate polishing composition includes a abrasive A 1, a basic compound B 1, and a surface protective agent S 1. The surface protective agent S 1 comprises a high water-soluble polymer P 1 than the weight average molecular weight of 30 × 10 4, further comprising a dispersing agent D 1, and dispersion parameter alpha 1 is less than 80%. |
priorityDate | 2017-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 135.