| abstract |
Disclosed is a resin material that can effectively improve insulation and thermal conductivity, can effectively suppress variations in dielectric breakdown strength, and can effectively improve adhesion. The resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, wherein an aspect ratio of primary particles constituting the first inorganic particles is 7 or more, and the first The aspect ratio of the primary particles constituting the inorganic particles of 2 is less than 7, the compressive strength at 10% compression of the first inorganic particles and the compressive strength at 10% compression of the second inorganic particles And 2 N / mm 2 or less. |