abstract |
Has a high glass transition temperature (high Tg) or no clear glass transition temperature (Tg-less), and sufficiently reduces the warpage of a printed wiring board, particularly a multilayer coreless substrate (achieves low warpage). In order to provide a resin composition, a prepreg, a laminate, a metal foil-clad laminate, a printed wiring board, and a multilayer printed wiring board, the resin composition according to the present invention contains a maleimide compound (A) and an allyl group It contains a compound (B), an epoxy resin (C) and / or a comb-shaped graft polymer (D) composed of a bisphenol A type structural unit and a hydrocarbon-based structural unit. The content of the epoxy resin (C) composed of the bisphenol A-type structural unit and the hydrocarbon-based structural unit or the comb-shaped graft polymer (D) in the resin composition is 3 to 25 with respect to 100 parts by mass of the resin solid content. Part by mass. |