| abstract |
It can be quickly cured at low temperature, has high adhesive strength (particularly peel strength) after curing, can suppress a decrease in adhesive strength (particularly peel strength) after the moisture resistance test of the cured resin composition, and A resin composition having an excellent pot life is provided. (A) an epoxy resin, (B) C (CH 2 OR 1) (CH 2 OR 2) (CH 2 OR 3) (CH 2 OR 4) ( wherein, R 1, R 2, R 3, and R 4 Are each independently hydrogen or C n H 2n SH, where n is 2 to 6. At least one of R 1 , R 2 , R 3 and R 4 is C n H 2n A resin composition containing a thiol compound represented by SH (wherein n is 2 to 6), (b) a thiol compound other than (b) above, and (C) a latent curing accelerator. Things are provided. |