http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018047849-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02 |
| filingDate | 2017-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2018047849-A1 |
| titleOfInvention | Resin composition, adhesive, sealing material, dam agent, and semiconductor device |
| abstract | A light and thermosetting resin composition is provided which has high adhesive strength (in particular, high peel strength) after curing, and can suppress the decrease in adhesive strength after a moisture resistance test after curing. (A) acrylic resin, (B) C (CH2OR1) (CH2OR2) (CH2OR3) (CH2OR4) (wherein, R1, R2, R3 and R4 are each independently hydrogen or C3H6SH, and R1, There is provided a resin composition containing a thiol compound represented by at least one of R2, R3 and R4 is C3H6SH, and (C) a latent curing accelerator. |
| priorityDate | 2016-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 249.