http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018008270-A1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
filingDate | 2017-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2018-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2018008270-A1 |
titleOfInvention | Conductive paste and conductive pattern forming method |
abstract | Provided is a conductive paste capable of forming a fine conductive pattern having sufficient conductivity and good adhesion to a substrate, and a method for forming the conductive pattern, and more specifically, using gravure offset printing A conductive paste capable of forming a conductive pattern having a line width of 5 μm or less and a method for forming a conductive pattern are provided. Silver fine particles and an organic solvent, the organic solvent includes a low-swelling organic solvent having a blanket swelling rate of 2.0% or less, and the content of the low-swelling organic solvent is 3.0 to 30 wt% A conductive paste characterized in that |
priorityDate | 2016-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 181.