| abstract |
A semiconductor device (1) includes a first substrate (5) having a first surface (6), a semiconductor element (7), and a first flexible connection electrically connected to the semiconductor element (7). A member (33), a first pad (30) connected to the first flexible connection member (33), and a second substrate (10) including a bump (15) and a wiring (12). Prepare. The second substrate (10) is a low-temperature sintered ceramic substrate (11) containing alkali metal ions. The first pad (30) is connected to the wiring (12) through the bump (15). In plan view from the direction along the normal line of the first surface (6), at least a part of the first pad (30) overlaps the semiconductor element (7). Therefore, the semiconductor device (1) can be miniaturized. |