Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-0445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-0446 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-044 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
filingDate |
2017-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2019-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-WO2017183489-A1 |
titleOfInvention |
Conductive substrate, method for manufacturing conductive substrate |
abstract |
A transparent substrate and a metal wiring formed on at least one surface of the transparent substrate, wherein the metal wiring has a copper wiring layer and a blackened wiring layer containing nickel and copper. The transparent base material having a laminated structure and exposed from between the metal wirings provides a conductive substrate having a visible light transmittance of 90% or more and b * of 1.0 or less. |
priorityDate |
2016-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |