http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017170012-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2017170012-A1 |
| titleOfInvention | Method for manufacturing metal wiring-containing laminate, metal wiring-containing laminate, and substrate with plated layer |
| abstract | The present invention provides a method for producing a metal wiring-containing laminate, a metal wiring-containing laminate, and a substrate with a layer to be plated, which can efficiently produce a metal wiring-containing laminate having fine metal wiring with low resistance. To do. The method for producing a metal wiring-containing laminate of the present invention comprises a step of forming a photosensitive layer having a functional group that interacts with a plating catalyst or a precursor thereof on a substrate, and exposing the photosensitive layer in a pattern. A step of developing the exposed photosensitive layer to form a layer to be plated having a groove, a step of applying a plating catalyst or a precursor thereof to the layer to be plated, and a plating catalyst or a precursor thereof. Performing a plating process on the applied layer to be plated and forming a metal wiring so as to fill the groove. |
| priorityDate | 2016-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.