| abstract |
The present invention provides a resin composition capable of suppressing surface roughness in a thin film forming portion and maintaining insulation reliability of the thin film forming portion, a cured relief pattern thereof, and a method of manufacturing a semiconductor electronic component or a semiconductor device using the resin composition. For the purpose. The configuration of the present invention for achieving the above object is as follows. That is, (a) at least one resin selected from alkali-soluble polyimide, alkali-soluble polybenzoxazole, alkali-soluble polyamideimide, their precursors and their copolymers, and (b) an alkali-soluble phenol resin The ratio (Rb / Ra) of the alkali dissolution rate (Ra) of the resin (a) and the alkali dissolution rate (Rb) of the resin (b) is 0.5 ≦ Rb / Ra. It is a resin composition satisfying the relationship of ≦ 2.0. Moreover, it is the hardening relief pattern of the resin composition, and the manufacturing method of a semiconductor electronic component or a semiconductor device using the same. |