| abstract |
The subject of this invention is providing the film with a to-be-plated layer precursor layer which can form the metal layer excellent in the manufacturability by a roll to roll, and excellent in adhesiveness with a board | substrate. Moreover, the other subject of this invention is providing the film with a pattern-form to-be-plated layer, a conductive film using the same, and a touch panel. The film with a to-be-plated layer precursor layer of the present invention is a film with a to-be-plated layer precursor layer having a substrate, an undercoat layer and a to-be-plated layer precursor layer arranged in order from the substrate side on the substrate. The undercoat layer has a surface hardness of 10 N / mm 2 or less and a friction coefficient with the release paper of 5 or less. |