Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-5436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-665 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-5463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P10-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3286 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F5-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-3414 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y80-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F10-28 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F7-00 |
filingDate |
2016-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2017-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-WO2017115648-A1 |
titleOfInvention |
Manufacturing method of sputtering target |
abstract |
(1) A method for producing a sputtering target with improved crystal orientation controllability is provided. A method for producing a sputtering target, comprising a step of shaping at least one raw material powder selected from metals and metal oxides into a desired target shape by an additive production method. (2) A method for producing a sputtering target capable of improving production efficiency is provided. Backing plate including a forming step of forming at least one kind of raw material powder selected from metal and metal oxide into a desired sputter part shape by an additional manufacturing method on a backing plate or an intermediate material provided on the backing plate And a sputtering target manufacturing method in which a sputter part is bonded. |
priorityDate |
2015-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |