http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017056534-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate | 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2017056534-A1 |
| titleOfInvention | Roughening copper foil, copper clad laminate and printed wiring board |
| abstract | Provided is a roughened copper foil capable of significantly improving adhesion to an insulating resin and reliability (for example, moisture absorption heat resistance). The roughened copper foil of the present invention has a roughened surface with fine irregularities composed of needle crystals on at least one side, and the entire surface of the needle crystals is made of Cu metal and Cu 2 O. It consists of a mixed phase. |
| priorityDate | 2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.